发明名称 Polymer Compound, Photoresist Composition Containing Such Polymer Compound, and Method for Forming Resist Pattern
摘要 A polymer compound that, within a chemically amplified positive resist system, exhibits a significant change in alkali solubility from a state prior to exposure to that following exposure, as well as a photoresist composition that includes such a polymer compound and a method for forming a resist pattern, which are capable of forming fine patterns with a high level of resolution. The polymer compound includes, as an alkali-soluble group (i), a substituent group in which a group selected from amongst alcoholic hydroxyl groups, carboxyl groups, and phenolic hydroxyl groups is protected with an acid dissociable, dissolution inhibiting group (ii) represented by a general formula (1) shown below: [Formula 1] <?in-line-formulae description="In-line Formulae" end="lead"?>-CH<SUB>2</SUB>-O-A<img id="PRIVATE-USE-CHARACTER-00001" he="7.20mm" wi="8.47mm" file="US20070224520A1-20070927-Brketopenst.TIF" alt="private use character Brketopenst" img-content="character" img-format="tif" />O-CH<SUB>2</SUB>-]<SUB>n</SUB> (1) <?in-line-formulae description="In-line Formulae" end="tail"?> (wherein, A represents an organic group of 1 to 20 carbon atoms with a valency of at least n+1, and n represents an integer from 1 to 4).
申请公布号 US2007224520(A1) 申请公布日期 2007.09.27
申请号 US20050578189 申请日期 2005.04.05
申请人 OGATA TOSHIYUKI;MATSUMARU SYOGO;HADA HIDEO;YOSHIDA MASAAKI 发明人 OGATA TOSHIYUKI;MATSUMARU SYOGO;HADA HIDEO;YOSHIDA MASAAKI
分类号 C08F8/00;C07C69/54;C08F20/20;G03F7/004;G03F7/039 主分类号 C08F8/00
代理机构 代理人
主权项
地址