发明名称 MANUFACTURING METHOD OF A SEMICONDUCTOR DEVICE
摘要 Mask sheets, a cleaning sheet and rubbery cleaning resin bars are disposed on a lower mold of a molding die and thereafter the molding die is clamped, allowing the interior of a cavity to be filled with cleaning resin to clean the molding die, whereby even portions into which resin is difficult to enter with only the injection pressure from pots can be filled with the cleaning resin. Consequently, cleaning of the molding die can be effected without being influenced by the resin injection pressure in transfer molding and it is possible to improve the cleanability of the molding die.
申请公布号 US2007210468(A1) 申请公布日期 2007.09.13
申请号 US20070626455 申请日期 2007.01.24
申请人 发明人 TSUCHIDA KIYOSHI
分类号 B29C33/72;B29C70/34 主分类号 B29C33/72
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