| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a multipiece wiring board in which cracking between a wiring board region and a dummy region is prevented effectively even in case of miniaturization or high density mounting. <P>SOLUTION: In the multipiece wiring board having a plurality of wiring board regions 11, and a dummy region 12 at the periphery thereof on a mother substrate 10, a plurality of through-holes 21 having a through conductor 20 internally are formed in the wiring board regions 11 while being arranged, and a plurality of holes 30 are formed in the dummy region 12. Preferably, the hole 30 is a dummy through-hole 31. <P>COPYRIGHT: (C)2007,JPO&INPIT |
