| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a heating and pressurizing adhesion apparatus for electronic components which has a new structure capable of photographing up to the completion of their heating and pressurizing adhesion the state wherein works are aligned with each other. <P>SOLUTION: The heating and pressurizing adhesion apparatus has a stage for setting thereto a plurality of works and has a heating and pressurizing head for so descending to the overlap of the plurality of works from their upper side as to heat them compressively. The stage can move in the horizontal direction between an alignment position for setting thereto the works and a heating and pressurizing position present on the lower side of the heating and pressurizing head. Further, the stage is so constituted that a light is made transmissible through the mounting portion of the overlap of the plurality of works. Moreover, photographing devices 15 are fastened to the stage movably with the stage. Hereupon, each photographing device 15 includes a light source 15a for irradiating the overlap of the plurality of works from their lower side, optical systems 15b, 15c for receiving the light reflected by the overlap of the plurality of works to acquire the image thereof, and a camera 15d. <P>COPYRIGHT: (C)2007,JPO&INPIT |
