| 摘要 |
<p>The invention relates to a high frequency circuit module in which a two- or more-layer dielectric substrate (1, 18, 24, 30) is used, the dielectric substrate between a conductor line of a matching circuit (2-5, 9-12) on the input side or on the output side and ground metal (19, 29, 33, 34, 36-39) is composed of two or more layers and the miniaturization is enabled and a communication device using it. As a required part can be thickened without changing the thickness of the whole dielectric substrate, the transmission loss can be reduced and the miniaturization of the high frequency circuit module and the communication device using it is enabled. <IMAGE></p> |
