发明名称 |
High-frequency chip packages |
摘要 |
A packaged semiconductor chip includes features such as a chip carrier having a large thermal conductor which can be solder-bonded to a circuit panel so as to provide enhanced thermal conductivity to the circuit panel and electromagnetic shielding and a conductive enclosure which partially or completely surrounds the packaged chip to provide additional heat dissipation and shielding. The packaged unit may include both an active semiconductor chip and a passive element, desirably in the form of a chip, which includes resistors and capacitors. Inductors may be provided in whole or in part on the chip carrier.
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申请公布号 |
US7268426(B2) |
申请公布日期 |
2007.09.11 |
申请号 |
US20040783314 |
申请日期 |
2004.02.20 |
申请人 |
TESSERA, INC. |
发明人 |
WARNER MICHAEL;SMITH LEE;HABA BELGACEM;URBISH GLENN;BEROZ MASUD;KANG TECK-GYU |
分类号 |
H01L23/10;H01L23/24;H01L23/31;H01L23/34;H01L23/367;H01L23/433;H01L23/498;H01L23/552;H01L23/64;H01L25/065;H03H9/05;H03H9/10 |
主分类号 |
H01L23/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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