发明名称 Treating solution supply nozzle, a substrate treating apparatus having this nozzle, and a method of manufacturing a treating solution supply nozzle
摘要 A resin block has a treating solution channel extending between and opening at front and back surfaces thereof. Heat conductive members are face-bonded to the front and back surfaces of the resin block, respectively, for closing the channel. Consequently, no air is present between the resin block and heat conduction members, thereby improving the efficiency of heat exchange. A nozzle of simple construction is realized only by face-bonding the two heat conductive members to the open front and rear surfaces of the resin block. Temperature control plates hold the heat conductive members along with the resin block to effect a temperature control, whereby the temperature of a treating solution in the treating solution channel is controlled effectively through the heat conductive members. The treating solution adjusted to a desired temperature is delivered from a discharge opening to a substrate for performing substrate treatment with high accuracy.
申请公布号 US7267723(B2) 申请公布日期 2007.09.11
申请号 US20040836146 申请日期 2004.04.30
申请人 DAINIPPON SCREEN MFG. CO., LTD. 发明人 GOTO SHIGEHIRO;KOBAYASHI HIROSHI
分类号 B05B7/16;B05C5/04;B05C11/00;B05C11/08;B05C11/10;H01L21/00 主分类号 B05B7/16
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