A side view LED(Light Emitting Diode) package is provided to improve a light emissive efficiency by forming easily a light transmitting resin like a convex lens type structure using an opening with a stepped portion. A side view LED package includes a package body and a light transmitting resin. The package body(55) has an opening capable of exposing an LED chip to the outside. The light transmitting resin(63) is used for enclosing the LED chip. The opening of the package body has a stepped portion(65b) capable of partitioning the opening itself into an upper portion and a lower portion. The light transmitting resin is filled in the lower portion of the opening under the stepped portion. The light transmitting resin is formed like a convex lens type structure.
申请公布号
KR100757826(B1)
申请公布日期
2007.09.11
申请号
KR20060095654
申请日期
2006.09.29
申请人
SEOUL SEMICONDUCTOR CO., LTD.
发明人
KIM, HWA JA;KIM, NAM YOUNG;HAN, KYOUNG BO;LEE, MYUNG HEE;KIM, TAE KWANG;SO, JI SEOP