| 摘要 |
A flip chip package and a manufacturing method thereof are provided to control short phenomenon between adjacent conductive bumps by arranging second pads of a substrate centering on first pads of a semiconductor chip in a zigzag form. A semiconductor chip(110) has first pads(112) arranged along a first direction. A substrate(120) is opposite to the semiconductor chip. The substrate has second pads arranged in a zigzag form by centering of the first pads. Conductive bumps(131,132) connect the first pads and the second pads one-on-one. The neighboring conductive bumps are extended to different directions one another. The second pads are arranged along a first direction. The first pads have a first pitch. The second pads have a second pitch that is two times greater than the first pitch. Each conductive bump includes a stud and a tail. The stud is contacted to the first pad. The tail is extended from the stud to be contacted to the second pad. |
