| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition affording a cured product having excellent heat resistance, high modulus of elasticity and high toughness and having low reaction heat buildup during curing. SOLUTION: The epoxy resin comprises at least a glycidyl ether type epoxy resin [A], a bisphenol S type epoxy resin [B] and a thermoplastic resin [C]. The glycidyl ether type epoxy resin [A] contains≥2.2 epoxy groups in the molecule. The thermoplastic resin [C] has a structure represented by general formula (1). COPYRIGHT: (C)2007,JPO&INPIT |
