| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic device housing which comprises individually bonding a synthetic resin body having an attaching part and an adhesive part to a metal case, and to provide its molding method. SOLUTION: A synthetic resin body is molded at a specified predetermined position of a processed metal case 6. The synthetic resin body includes a plurality of attaching parts 8a such as a tap hole or the like and adhesive parts 8b consisting of islands bonded to the metal case 6. The adhesive parts 8b are constituted individually and have minimum adhesive areas. Before the synthetic resin body is injected to the metal case 6, the metal case 6 is surface-treated for firming up adhesion. COPYRIGHT: (C)2007,JPO&INPIT |
