发明名称 MULTI PROCESSING PLASMA CHAMBER
摘要 A multiple plasma reactor is provided to process at least two wafers in a row at a high speed by generating inductive coupled plasma of high-density. A vacuum chamber(110) has upper chambers(120) protruding from an upper portion of the vacuum chamber. At least two tubular discharge bridges(133) connect the upper chambers. A transformer(130) has at least one discharge bridge mounted in a magnetic core and a primary winding(132) supplied with radio frequency. A power supply source(140) supplies the radio frequency to the primary winding. A continuous plasma discharge loop is formed by the upper chambers and the discharge bridges.
申请公布号 KR100756084(B1) 申请公布日期 2007.09.05
申请号 KR20060047909 申请日期 2006.05.29
申请人 WI, SOON IM 发明人 WI, SOON IM
分类号 H01L21/3065 主分类号 H01L21/3065
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