<p>A thermally enhanced electronic module (100) includes a thermally conductive case (112), a self-aligning thermally conductive heat sink (114) and a die (116). The case (112) includes a pivot area (140) with a first shape formed into the case (112) for receiving a first portion of the heat sink (114) and a first portion of the heat sink (114) has a second shape that is complementary to the first shape. The die (116) includes a first surface and a second surface opposite the first surface. The die (116) is mounted to a substrate (124) with the first surface of the die (116) facing the substrate (124) and the second surface of the die (116) is in thermal contact with the heat sink (114).
</p>
