| 摘要 |
<p>An image pickup device wherein production yield is remarkably improved and long-term reliability of the device is ensured, and a method for manufacturing such image pickup device are provided. The image pickup device is characterized in that a front plane section of a wafer (1) is provided with a multitude of light receiving sections (2), a microlens (3) is formed on each light receiving section, penetrating electrodes (4) for supplying power to the light receiving section (2) and for transmitting and receiving an electrical signal to and from the light receiving section are provided at ubiquitous areas in the periphery of the wafer (1), one end of the penetrating electrode (4) is connected to an electrode pad (4a) connected to a wiring to a light receiving element on the front plane section of the wafer (1), and the other end is connected to the wiring through a rear plane electrode (5). The image pickup device is further characterized in that the front plane of the wafer (1) is provided with a rib (7) as a partition wall section arranged on the four sides to surround the microlens (3); on an upper plane of the rib (7), a transparent substrate (8) such as of optical glass is bonded with an adhesive, and a bonding section of the rib (7) and the transparent substrate (8) is provided with a protection frame (10).</p> |
