| 摘要 |
PROBLEM TO BE SOLVED: To provide a supply method of conductive paste where the amount of conductive paste to be supplied becomes stable. SOLUTION: The supply method of conductive paste comprises: a conductive paste filling process 42 for filling solder paste 43 into recesses 61, 62 to a film 63 made of resin in which the recesses 61, 62 are formed at positions corresponding to connection lands 28, 29; a sticking process 46 for sticking the film 63 to a wiring board 22, so that the connection lands 28, 29 oppose the recesses 61, 62 after the conductive paste filling process 42; a contact/transfer process 47 for bringing the conductive paste 43 into contact with the connection lands 28, 29, by heating or pressurizing in the stuck state; and a peeling process 48 for peeling the film 63 from the wiring board 22 after the contact/transfer process 47. COPYRIGHT: (C)2007,JPO&INPIT
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