| 摘要 |
PROBLEM TO BE SOLVED: To provide a laminate for a COF, a COF film carrier tape obtained by processing the laminate, and an electronic device having an electronic component mounted on a wiring board, whereby dimensional changes and deformations caused by heat on the film carrier tape can be suppressed, even if the electronic component including an IC and an LSI is mounted on the film carrier tape and so on at high temperatures through metal eutectic mounting, a metal wire and the bump of an IC chip are not displaced from each other, an amount of the embedded metal wire into the bump is small, high adhesion is obtained between the metal wire and insulating layer, and the reliability of connection between the electronic component and the film carrier tape can be improved. SOLUTION: The laminate plate for a COF has a conductor 20, laminated on one side or both sides of an insulating layer 10. The insulating layer has a multilayer structure of polyimide resin, and the laminate plate for COF has a glass transition temperature of 350°C or higher, and a coefficient of linear expansion of 70 ppm/°C or lower at 300 to 350°C, and the COF film carrier tape is obtained by processing the laminate. COPYRIGHT: (C)2007,JPO&INPIT |
