| 摘要 |
In the polishing machine, bad influence caused by a surface condition of a retainer ring can be reduced with a simple structure. The polishing machine comprises: a rotatable polishing plate (15); a top ring (10) including a holding plate (22) for holding and pressing a wafer (W) onto polishing cloth (16) of the polishing plate (15); a retainer ring (40) in which the holding plate (22) is freely inserted, the retainer ring (40) independently rotating, the retainer ring (40) including a pressing member (42), which presses the polishing cloth (16) along an outer edge of the wafer (W) so as to make level of the polishing cloth (16) pressed by the pressing member (42) substantially equal to that of the polishing cloth (16) pressed by the wafer (W); and a positioning member (50) for correctly positioning the retainer ring (40) on the polishing cloth (16) while the retainer ring is rotated. <IMAGE> |
