METHOD FOR MANUFACTURING BUMP OF PROBE CARD

摘要

A method for forming a bump of a probe card is provided to acquire a high aspect ratio from the bump without the use of a photoresist layer by forming a probe tip and the bump using a semiconductor substrate as a mold. A protective layer pattern for defining a bump region is formed on a first surface of a semiconductor substrate. A metal film is formed on a second surface of the substrate. A bump region is formed on the resultant structure by etching selectively the substrate and the metal film using the protective layer pattern as an etch mask. The protective layer pattern and the metal film are removed from the resultant structure. An insulating layer is formed on the substrate including the bump region. The substrate is bonded to a ceramic substrate(230). A bump(190a) is formed on the resultant structure by filling the bump region.