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发明名称
Epoxy resin composition for sealing Semiconductor device
摘要
申请公布号
KR100751181(B1)
申请公布日期
2007.08.22
申请号
KR20050126823
申请日期
2005.12.21
申请人
发明人
分类号
C08L63/00;C08K5/16
主分类号
C08L63/00
代理机构
代理人
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地址
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