| 摘要 |
A PCB(Printed Circuit Board) is provided to prevent the warpage of the PCB by processing an edge of the PCB to disperse heat, and to remove contact failure due to the warpage. A PCB includes a substrate unit(C) and at least one groove unit(D). Electronic devices are mounted on the substrate unit(C). The at least one groove unit(D) is formed on at least one surface of the substrate unit(C). The substrate unit(D) has a square shape. The groove unit(D) is formed on surfaces of the substrate opposite to each other. The substrate unit(C) is a multi-layer substrate. A maximum thickness of the substrate unit(C) is 0.7 mm. Minimum longitudinal and transverse lengths of the substrate unit(C) are 50 mm.
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