| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayered wiring board having an excellent electric connectability by sufficiently increasing the adhesive strength of conductors between layers to prevent poor connection, and to provide its manufacturing method. SOLUTION: The manufacturing method of the multilayered wiring board comprises processes of: forming insulation layers 3 each of which contains conductor patterns 2 and via conductors 7, and whose top face is nearly flush with the top face of the conductor patterns 2; forming coating layers 9 and 10 for selectively coating the insulation layers 3 and the via conductors 7 of the insulation layer 3 located at least in either the most upper or most lower layer of a laminate 8 built by stacking a plurality of insulation layers 3; and applying pressure to the laminate 8 formed with the coating layers 9 and 10 in the stacking direction. COPYRIGHT: (C)2007,JPO&INPIT |
