| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for uniformly covering a particle surface with a thin film by using a sputtering technique, and to provide an apparatus to be used therefor. SOLUTION: The method for covering the particle surface with the thin film of a covering material by using the sputtering technique includes the steps of: accommodating the particles in a particle container; and slightly moving the particle container up and down with a voice-coil-type electrodynamic shaker to vibrate the particles through the particle container. COPYRIGHT: (C)2007,JPO&INPIT
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