发明名称 METHOD OF MANUFACTURING PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing a printed wiring board capable of preventing the occurrence of cracks around an opening and having excellent production efficiency. SOLUTION: This method is a method of manufacturing a printed wiring board 1 having an opening 11 formed thereon and provided with a conductor wiring 12 on the surface around the opening 11. A punching machine 2 having a stripper 21 for pressing the printed wiring board 1 and a punch 22 for punching the printed wiring board 1 in the inside of the stripper 21 is used to form the opening 11. A resin layer 3 for covering the conductor wiring 12 and having a flat surface 31 is formed on the surface of the printed wiring board 1. After that, the punch 22 is slid with the stripper 21 abutting on the surface 31 of the resin layer 3, thereby forming the opening 11. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007208204(A) 申请公布日期 2007.08.16
申请号 JP20060028792 申请日期 2006.02.06
申请人 IBIDEN ENGINEERING KK 发明人 YAMAGISHI YUKIO;KIMURA HIROSHI
分类号 H05K3/00;B26F1/00 主分类号 H05K3/00
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