METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE WITH PROTECTION LAYER

摘要

A method for manufacturing a semiconductor device may comprise preparing a wafer having a front surface and a back surface. The wafer may have a plurality of semiconductor chips and scribe lines between the adjacent semiconductor chips. The wafer may be sawn along the scribe lines to form grooves between the adjacent semiconductor chips. A liquid protection material may be screen printed or spin-coated to form a protection layer on the back surface and within the grooves. The protection layer within the grooves may be more narrowly cut to form individual semiconductor devices and to leave a protection layer remaining thereon.