Process for transferring a thin layer formed in a substrate having crystal originated particles (COPs).

摘要

The production involves forming an insulating layer before SMARTCUT(RTM: Not defined) type transferring of a part of a donor substrate towards a support substrate, where the layer does not increase the size of crystal originated particles (COP) present in the part of the donor substrate with a density. The particles are healed after transferring the part of the donor substrate for reducing the density to another density. Independent claims are also included for the following: (1) an on-insulator semiconductor substrate comprising an insulating layer; and (2) recycling a substrate.