CHEMICAL MECHANICAL POLISHING SYSTEM

摘要

A CMP system is provided to eliminate the necessity for installing a dummy wafer station in a position except a wafer cassette loading/unloading part. A wafer is chemically and mechanically polished by a polishing part(500). The wafer is cleaned by a cleaning part(300). A factory interface robot(200) transfers the wafer between a wafer cassette loading/unloading part(100) and the cleaning part. A dummy wafer is stored in a dummy wafer station adjacent to the factory interface robot. A wet robot(400) transfers the wafer between the polishing part and the cleaning part.