| 摘要 |
PROBLEM TO BE SOLVED: To provide an Ag wiring board capable of suppressing Ag migration. SOLUTION: The Ag wiring board includes, on a substrate 11, circuit elements 12 made of a thin film having Ag as a conductor and a resin layer 13 provided at least between two circuit elements 12 adjacent to each other among the elements 12 and with different potentials, in which metal particles 13a with larger ionization inclination than Ag are dispersed in a base resin 13b. COPYRIGHT: (C)2007,JPO&INPIT
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