| 摘要 |
A semiconductor device and a manufacturing method thereof are provided to improve the performance and reliability, to enhance the efficiency and to reduce fabrication costs by mounting a semiconductor chip onto a substrate through an adhesive without the generation of bubbles in the adhesive. A semiconductor device includes a semiconductor chip(11) with electrode pads(12) and a substrate(14) with electrode terminals(15) corresponding to the electrode pads. A plurality of bumps(13) are formed on at least one of the electrode pads. The bump is composed of a base portion(13A) and a protruded portion(13B) on the base portion. The diameter of the protruded portion is smaller than that of the base portion. The bumps contact each other through the base portions. The semiconductor chip and the substrate are fixed to each other by using an adhesive(17) in an electrical connection state between the bump and the electrode terminal. |
