发明名称 MANUFACTURING METHOD OF STRUCTURE, WIRING BOARD, AND STRUCTURE WITH INTERCONNECTION
摘要 PROBLEM TO BE SOLVED: To provide a conductor which is very useful for filling holes bored in a base material. SOLUTION: Holes 14 bored in the base material 12 are filled up with conductors 15 formed of zinc or zinc aluminum alloy. Zinc or zinc aluminum alloy is melted at a temperature of 375°C or above. The holes 14 bored in the base material 12 can be surely filled up with the molten zinc or molten zinc aluminum alloy. Zinc or zinc aluminum alloy is electrically conductive, so that the holes 14 can be surely filled up with the electric conductors 15. Such a structure is capable of keeping a solid state even if it is secondarily exposed to, for instance, the melting temperature of a solder alloy. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007201188(A) 申请公布日期 2007.08.09
申请号 JP20060018128 申请日期 2006.01.26
申请人 FUJITSU LTD 发明人 KITAJIMA MASAYUKI;MATSUYAMA RYOJI
分类号 H01L23/14;H01L23/13;H01L23/15 主分类号 H01L23/14
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