| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To promote thinning and high densification in an inter-substrate connector by eliminating mutual connection between three-dimensional complicated metal springs. <P>SOLUTION: The inter-substrate connector 1 has an umbrella-shaped bump 43 for electric conduction on the substrate 41, a connector 4 connected to the circuit board 2 that is conducted to this bump 43, and an elastic conductive part 54 having a through-hole 55 in a conductive pattern 53 on an insulation substrate made by an elastic body, and is provided with the connector 5 which is connected to the circuit board 3 conducted to this elastic conductive part 54. This elastic conductive part 54 can be inserted into the bump, and is arranged to be conducted to the bump 43 when inserted into the bump 43, and a side face of the through hole 55 is pushed by the bump 43 and elastically deformed to form a dent so that the bump 43 cuts into the through-hole 55. By this, since the elastic conductive part 54 can be inserted into the bump 43 and can be locked, electrical and mechanical inter-substrate connections can be accomplished simultaneously and two-dimensionally, so that a height reduction can be realized. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
