发明名称 |
Wafer cleaning apparatus with multiple wash-heads |
摘要 |
A wafer cleaning apparatus with multiple wash-heads is applied in chemical and mechanical polishing process after wafer cleaning. The wafer cleaning apparatus device includes a supporting base, which supporting base comprises a driving device and at least one fluid pipe. A rotation module is also included in the wafer cleaning apparatus. The top side of the rotation module is connected with the driving device. Besides, the rotation module comprises multiple wash-heads and at least one nozzle. The bottom side of wash-head here is contacted with the surface of the wafer. By using driving device, the rotation module can be wholly driven. Also, multiple wash-heads can rotate individually along a cleaning path for cleaning wafer. The fluid was jetted from nozzle and assistant to clean wafer through fluid pipe. The prior art of single wafer wash-head is easily to reform a cleaning dead angle in wafer cleaning process.
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申请公布号 |
US7252099(B2) |
申请公布日期 |
2007.08.07 |
申请号 |
US20030655224 |
申请日期 |
2003.09.05 |
申请人 |
NAN YA TECHNOLOGY CORPORATION |
发明人 |
CHEN CHIH-KUN;KUNG YAO-HSIUNG |
分类号 |
B08B3/00;B08B3/02;H01L21/00 |
主分类号 |
B08B3/00 |
代理机构 |
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