| 摘要 |
The invention relates to flux containing no boric acid made from inorganic boron compounds for brazing metallic materials in connection with silver-, copper- or nickel-based solders. According to the invention, a further flux for brazing may be provided which is free of boric acid and which leads to a good wetting of the workpieces for connection, characterised by residues of low corrosivity, wherein the boron compounds include potassium pentaborate and potassium metaborate and the weight proportion of potassium pentaborate and potassium metaborate lies in the range between 4 and 10. |
