发明名称 |
Substrate cleaning apparatus, substrate cleaning method, and medium for recording program used for the method |
摘要 |
In a substrate cleaning method and a substrate cleaning method according to the present invention, a brush 3 is brought into contact with a substrate W while rotating the same, and a cleaning position Sb of the brush 3 is moved relative to the substrate W from a center part of the substrate W toward a peripheral part thereof. A process fluid formed of liquid droplets and a gas is sprayed by a two-fluid nozzle 5 onto the substrate W, and a cleaning position Sn of the two-fluid nozzle 5 is moved relative to the substrate W from a center part of the substrate W toward a peripheral part thereof. During the movement of the cleaning position Sb of the brush 3 from the center part of the substrate W toward the peripheral part thereof, the cleaning position Sb of the two-fluid nozzle is positioned nearer to a center P<SUB>0 </SUB>than the cleaning position Sb of the brush 3 . Since contaminations of the brush are prevented from adhering again to the wafer, it can be avoided that the wafer W is contaminated.
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申请公布号 |
US2007175501(A1) |
申请公布日期 |
2007.08.02 |
申请号 |
US20050593560 |
申请日期 |
2005.04.05 |
申请人 |
AMAI MASARU;SEKIGUCHI KENJI;ORII TAKEHIKO;OHNO HIROKI;TANAKA SATORU;MORI TAKUYA |
发明人 |
AMAI MASARU;SEKIGUCHI KENJI;ORII TAKEHIKO;OHNO HIROKI;TANAKA SATORU;MORI TAKUYA |
分类号 |
B08B3/00;B08B1/04;H01L21/00;H01L21/304 |
主分类号 |
B08B3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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