| 摘要 |
PROBLEM TO BE SOLVED: To prevent ink from flowing even into a nondefective semiconductor chip by controlling the ink flow for marking due to the nonuniformity of bump arrangement density by using a dummy bump formed as electric nonconductor. SOLUTION: In a driving IC 1 whose arrangement density of input bumps 5 are sparser than the arrangement density of output bumps 4, dummy bumps 6 are formed in the vicinity of the position where the ink for marking is applied (for example, the central part of the driving IC 1) and in the clearance between the input bumps 5, so that the spread of the ink for marking may be prevented. COPYRIGHT: (C)2007,JPO&INPIT
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