METHOD OF PACKAGING OF MEMS DEVICE AT THE VACUUM STATE USING A SILICIDE BONDING AND VACUUM PACKAGED MEMS DEVICE USING THE SAME

摘要

A vacuum mounting method of a micro electro mechanical systems device using a silicide bonding and a vacuum mounted micro electro mechanical systems device using the same are provided not to generate a leakage by performing a bonding at a low temperature. A vacuum mounted MEMS(Micro Electro Mechanical Systems) device using a silicide bonding includes a bottom silicon substrate(125), a top glass substrate(130), and a silicide adhering layer(170). An MEMS device structure(120) is formed in the bottom silicon substrate. A cavity(135) is formed inside of the top glass substrate. The silicide adhering layer composed of a first silicide(160), a metal layer(155), a second silicide(150), an amorphous silicon layer(145) and an adhering layer(140) is formed on the bottom silicon substrate. The MEMS device structure is vacuum-mounting between the bottom silicon substrate and the top glass substrate.