| 发明名称 |
Apparatus and methods for packaging integrated circuit chips with antennas formed from package lead wires |
| 摘要 |
Apparatus and methods are provided for integrally packaging semiconductor IC (integrated circuit) chips with antennas having one or more radiating elements and tuning elements that are formed from package lead wires that are appropriated shaped and arranged to form antenna structures for millimeter wave applications.
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| 申请公布号 |
US2007170560(A1) |
申请公布日期 |
2007.07.26 |
| 申请号 |
US20060340934 |
申请日期 |
2006.01.26 |
| 申请人 |
GAUCHER BRIAN P;LIU DUIXIAN;PFEIFFER ULLRICH R;ZWICK THOMAS M |
发明人 |
GAUCHER BRIAN P.;LIU DUIXIAN;PFEIFFER ULLRICH R.;ZWICK THOMAS M. |
| 分类号 |
H01L23/495;H01L21/00 |
主分类号 |
H01L23/495 |
| 代理机构 |
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| 主权项 |
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