发明名称 |
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE THEREOF |
摘要 |
Vertically stacked integrated circuits and methods of fabrication thereof are disclosed. Deep vias that provide vertical electrical connection for vertically stacked integrated circuits are formed early in the manufacturing process, before integrated circuits are bonded together to form a three dimensional integrated circuit (3D-IC). |
申请公布号 |
WO2007082854(A1) |
申请公布日期 |
2007.07.26 |
申请号 |
WO2007EP50321 |
申请日期 |
2007.01.15 |
申请人 |
INFINEON TECHNOLOGIES AG;KNORR, ANDREAS |
发明人 |
KNORR, ANDREAS |
分类号 |
H01L23/48;H01L21/768;H01L25/065 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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