METHODS AND APPARATUSES FOR DYNAMIC PROBE ADJUSTMENT
摘要
<p>An improved method and apparatus for automatically aligning probe pins to the test or bond pads of semiconductor devices under changing conditions. A dynamic model is used to predict an impact of changing conditions to wafer probing process. This reduces the need for frequent measurements and calibrations during probing and testing, thereby increasing the number of dice that can be probed and tested in a given period of time and increasing the accuracy of probing at the same time. It is also possible to adjust positions of probe pins and pads in response to the changing conditions while they are in contact with each other.</p>
