| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent an electric connection of an electronic component from being broken in a thermal process. <P>SOLUTION: An embodiment of the present invention has a component substrate 16, an element (an IDT electrode 17) arranged on the undersurface of the component substrate 16 and lead-out electrodes (a receiving terminal 24, an antenna terminal 25, a transmission terminal 26, and a ground terminal 27) arranged at an outer periphery of the element 17, a wiring line 18 connecting the lead-out electrodes 24 to 27 to the element 17, adhesion parts 19 provided on undersurfaces of the wiring line 18 and lead-out electrodes 24 to 27, and a component cover 20 which is connected to the component substrate 16 through the adhesion parts 19. The component cover 20 has through holes 21 formed at parts corresponding to the downside of the lead-out electrodes 24 to 27, and external terminal connection parts 22 formed in the inside of the through holes 21. Consequently, the deformation of the electronic component (SAW duplexer 15) is reduced and then thermal reliability of the electronic connection can be improved. <P>COPYRIGHT: (C)2007,JPO&INPIT |
