| 摘要 |
An IC(Integrated Circuit) device and a boundary scan test method are provided to quickly perform a boundary scan test by executing a boundary scan function in parallel with at least two boundary scan chains comprising boundary scan cells. An IC device(100) is composed of a semiconductor die(10) having plural input/output or bidirectional pads(11); boundary scan cells(20,20f,20s) combined to plural input/output or bidirectional pads respectively; at least two boundary scan chains(31,32) comprising the boundary scan cells; an interface unit(50) connected with the boundary scan chains respectively to input/output a test signal; and a control unit connected to the interface unit to provide a control signal for controlling the boundary scan chains. A boundary scan test signal is input to the boundary scan chains at the same time and a boundary scan function is executed in parallel.
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