发明名称 |
ALLOY MATERIAL FOR SEMICONDUCTOR, SEMICONDUCTOR CHIP USING SUCH ALLOY MATERIAL, AND METHOD FOR MANUFACTURING SAME |
摘要 |
According to the present invention, there is provided an alloy material for semiconductors containing of Au as a main component and Ag in the range of not less than 3 wt % to not more than 40 wt %. |
申请公布号 |
KR100742672(B1) |
申请公布日期 |
2007.07.25 |
申请号 |
KR20057009567 |
申请日期 |
2005.05.26 |
申请人 |
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发明人 |
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分类号 |
H01L21/00;H01L21/28;C22C5/02;H01L21/285 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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