发明名称 ALLOY MATERIAL FOR SEMICONDUCTOR, SEMICONDUCTOR CHIP USING SUCH ALLOY MATERIAL, AND METHOD FOR MANUFACTURING SAME
摘要 According to the present invention, there is provided an alloy material for semiconductors containing of Au as a main component and Ag in the range of not less than 3 wt % to not more than 40 wt %.
申请公布号 KR100742672(B1) 申请公布日期 2007.07.25
申请号 KR20057009567 申请日期 2005.05.26
申请人 发明人
分类号 H01L21/00;H01L21/28;C22C5/02;H01L21/285 主分类号 H01L21/00
代理机构 代理人
主权项
地址