<p>A method for manufacturing an LTCC(Low Temperature Cofired Ceramic) module is provided to improve the soldering property between organic PCBs(Printed Circuit Board) by previously forming a solder layer on an electrode pad unit. A method for manufacturing an LTCC module includes the steps of: forming a metal pad layer as an LGA(Land Grid Array) type for connection with an external substrate(150) on a bottom surface of an LTCC substrate(101); forming a solder layer(109) on a bottom surface of the metal pad layer; cutting the result structure with the solder layer(109) into a plurality of individual modules; and mounting the cut individual modules on the external substrate(150). The mounting step includes the steps of forming a solder for the external substrate(150) on a mounted surface of the external substrate(150) and applying heat to the solder for the external substrate(150) and the solder layer(109) of the individual module.</p>
