发明名称 |
Dual outlet nozzle for the combined edge bead removal and backside wash of spin coated wafers |
摘要 |
An apparatus and method for the improved combined edge bead removal and backside wash of spin coated semiconductor wafers is disclosed. This is preferably accomplished by providing a nozzle having a plurality of outlets adapted for the ejection of a cleaning fluid onto the backside of a semiconductor wafer. This cleaning fluid can be EEP or a similar EBR type of solvent. This dual outlet nozzle can be mounted to a stationary EBR arm, and preferably comprises two outlets located on a beveled top surface that are separated at a predetermined angle. The angle of this beveled top surface with respect to a horizontal plane of the processed wafer is preferably about 45 degrees, while the angle of each nozzle outlet with respect to a primary axis of the stationary EBR arm is also preferably about 45 degrees. Other angles are also possible in order to maximize solvent jet efficiency.
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申请公布号 |
US7247209(B2) |
申请公布日期 |
2007.07.24 |
申请号 |
US20030461068 |
申请日期 |
2003.06.12 |
申请人 |
NATIONAL SEMICONDUCTOR CORPORATION |
发明人 |
ROBERTSON GARY;FINLAY ROBERT BOYD |
分类号 |
B08B3/02;B08B7/00;G03F7/16;H01L21/00 |
主分类号 |
B08B3/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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