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发明名称
Polyamideimide resin for flexible printed circuit boards; metal-clad laminate, coverlay, and flexible printed circuit board that use this resin; and resin composition
摘要
申请公布号
US2007166559(A1)
申请公布日期
2007.07.19
申请号
US20070652462
申请日期
2007.01.11
申请人
ARISAWA MFG. CO., LTD.
发明人
TAI MAKOTO;DOBASHI SHU
分类号
C08G69/08;B32B15/08
主分类号
C08G69/08
代理机构
代理人
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