发明名称 |
STRUCTURE TO MONITOR ARCING IN THE PROCESSING STEPS OF METAL LAYER BUILD ON SILICON-ON-INSULATOR SEMICONDUCTORS |
摘要 |
The present invention addresses detection of charge-induced defects through test structures that can be easily incorporated on a wafer to detect charge-induced damage in the back-end-of-line processing of a semiconductor processing line. A test macro is designed to induce an arc from a charge accumulating antenna structure to another charge accumulating antenna structure across parallel plate electrodes. When an arc of a predetermined sufficient strength is present, the macro will experience a voltage breakdown that is measurable as a short. The parallel plate electrodes may both be at the floating potential of the microchip to monitor CMP-induced or lithographic-induced charge failure mechanisms, or have one electrode electrically connected to a ground potential structure to capture charge induced damage, hence having the capability to differentiate between the two.
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申请公布号 |
US2007164421(A1) |
申请公布日期 |
2007.07.19 |
申请号 |
US20060306944 |
申请日期 |
2006.01.17 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
AHSAN ISHTIAQ;BUNKE CHRISTINE M.;GRECO STEPHEN E. |
分类号 |
H01L23/52 |
主分类号 |
H01L23/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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