| 摘要 |
A semiconductor module includes: a plastic housing composition; at least one semiconductor chip with an active top side, a coplanar underside of the semiconductor module including the active top side of the semiconductor chip(s) and a surface of the plastic housing composition; a wiring structure arranged on the coplanar underside, the wiring structure including a center region and edge regions, with external contact areas distributed uniformly in the center region; external contacts arranged on the external contact areas of the wiring structure; and at least one surface-mountable semiconductor component arranged on the wiring structure in at least one of the edge regions, the surface-mountable semiconductor component(s) having a structural height that is less than the height of the external contacts. |
