| 摘要 |
A chip package with built-in capacitor structure including an integrated circuit (IC) unit, a capacitor unit, a carrier and a molding compound is provided. The capacitor unit is disposed on the IC unit and includes a first metal foil, a second metal foil, and a dielectric layer disposed between the first metal foil and the second metal foil. The carrier is disposed on the surface away from the dielectric layer of the second metal foil. The first metal foil is electrically connected to the carrier, the second metal foil is electrically connected to the carrier, the IC unit is electrically connected to the carrier, the IC unit is electrically connected to the first metal foil, and the IC unit is electrically connected to the second metal foil. The molding compound is disposed on the carrier for fixing the IC unit, the capacitor unit and the carrier.
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