| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a plasma treatment device and a plasma treatment method in which a problem of a possibility of occurrence of an irregular discharge in a reaction chamber which damages the point where the irregular discharge occurs and which melts a member and generates particles is solved by reducing a moisture degree in a treatment chamber to prevent the irregular discharging in a stable and reproducible way, without conducting a heat treatment by controlling a heating time which can be obtained empirically in a conventional method. <P>SOLUTION: A preparatory treatment chamber 10A is provided neighboring a vacuum treatment chamber 10 of the plasma treatment device. In the preparatory treatment chamber 10A, a substrate W is exposed to plasma by a power in which the substrate W is not plasma-treated, while measuring a moisture degree. Only after the moisture degree goes below a predetermined level, the substrate W is shifted to the vacuum treatment chamber 10 and a plasma treatment is conducted, and an irregular discharge is prevented in the vacuum treatment chamber 10. <P>COPYRIGHT: (C)2007,JPO&INPIT |
