| 摘要 |
In the present invention, a package structure and the method for manufacturing the same are provided. The package structure includes a substrate and a chip flip-chip bonded to the substrate. The chip has central connecting pads and surrounding connecting pads surrounding the central connecting pads. A plurality of first bumps and second bumps are disposed on the central connecting pads and surrounding connecting pads respectively in order to electrically connect the chip and substrate. The second bumps have indentations that can increase the areas to be soldered thereby balancing the bonding force of the solder to bond the second bumps to the corresponding contact pads of a substrate to avoid the detachment of the second bumps from the contact pads. |
