MANUFACTURING METHOD OF WIRING BOARD EQUIPPED WITH PASSIVE ELEMENT

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method of wiring board equipped with passive elements including an improved property.

SOLUTION: The method comprises the processes of: applying resistance paste and/or dielectric paste on at least either of first surface of first and second metal foils including the first surface and second surface, respectively; removing an edge of applied resistance paste and/or dielectric paste; arranging an insulating plate including thermoplastic and thermosetting by facing the first surface of the first metal foil, and arranging a first surface side of the second metal foil by facing a surface different to the surface to which the first metal foil of the insulating plate faces; forming a double-sided wiring board in such a way that three components of these arranged the first metal foil, insulating plate, and the second metal foil are integrally formed by processing in lamination with pressure and by heating; and patterning the first metal foil and/or the second metal foil of formed double-sided wiring board.

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